CNC Laser Cutting Machine

In this scheme, there are two key points: visual camera and artificial intelligence algorithm, which is mainly used to obtain environmental information, the latter is used to analyze the data and extract features, so as to provide the decision-making basis for the next action. Compared with the laser pointer radar, the visual environment perception technology oriented solutions, more mature technology, R & D threshold and lower cost, so in the past two years with the computer vision technology matures, as well as the rapid development of the Internet, artificial intelligence, cloud computing and other emerging technologies, has gained more and more attention to the automatic driving related enterprises. One of the most representative enterprise is tesla.

The output wavelength of the laser covers a shorter band, and the short wavelength laser has been widely used. Many advanced manufacturing processes require cold processing, such as in the manufacture of smart phones, often need to use short wavelength, short pulse UV laser to deal with. Short wavelength lasers have been widely used in surface marking, semiconductor wafer processing, drilling, cutting and other fields. The pulse speed of the laser is getting faster and faster, and the ultrafast laser has been developed rapidly. It has been driven into industrial applications by means of simpler structure, more convenient operation, lower cost and more stable performance.

With the development of blue green LED chip technology and the expansion of scale, the demand for laser cutting equipment is higher and higher, which has forced the laser equipment supplier to upgrade the equipment. At the same time due to a decrease in the development of green laser technology and the price of domestic laser dicing equipment also began to enter the market, a new generation of UV laser dicing equipment occurs, its production capacity has been increased to 3-5 times the generation of dicing machine, up to 15 pieces per hour.

When the sapphire as the substrate material, is widely used in LED chip production, the traditional cutting tool has been unable to meet the cutting requirements, manufacturers have been using 355nm and 266nm short wavelength nanosecond laser scribing, processing of sapphire wafer, the way to solve the difficulty of sapphire cutting and LED industry requirements for small and narrow cutting chip for, on sapphire substrate LED scale production, and may provide a guarantee of high quality cutting.

Cutting effect: wide opening, high cutting efficiency, short laser pulse, obvious gasification, more suitable for side wall corrosion process. With the rapid development of red laser pointer applications, the upstream optical component enterprises benefit from the development of the industry, showing overall growth. As the basic components, it has played a catalytic role in the development of laser industry.

According to the relative movement of the cutting head and the table, the CNC laser cutting machine can be divided into three types: the optical path, the fixed beam path, the beam moving form, the hybrid optical path and the semi-fixed semi-moving mixed mode. There is also a hinged movable arm fixed optical path flight beam transmission form, known as the constant flight optical path, referred to as constant light path. In the cutting process, only the blue laser pointer cutting head moves in the X and Y directions, and the table position is fixed. This kind of cutting machine processing plate size, large quality; equipment covers an area of small, no need to clamp the workpiece, on the material to facilitate; machine acceleration performance, high positioning accuracy. So much respected market, known as the mainstream of the international market models.